Designed for high-performance task needs, XPG Z1 memory modules feature superior thermodynamic-efficient design that consumes 20% less power than previous version memory even when running at up to 4266 MHz speed. Stronger PCB ensures lower electric resistance, steadier signal transfer and faster heat dissipation, resulting in higher performance and longer service life. Achieving top speed of up to 4266 MHz. XPG Z1 is available in multiple speed and capacities, giving hardcore gamers and overclockers desired performance and reliability. Every chip is selected through stringent screening process to ensure high-tier quality and meet specific performance requirements. With 2 oz. of extra heavy-duty double-copper layer, 10-layer Printed Circuit Board and our unique Thermal Conductive Technology, our Z1 series can dissipate heat more quickly and efficiently. Quickest way to improve your system performance is to add more memory. Improve your system performance with XPG’s high quality memory selections. Each of our memory stick is made with high quality chips in our fully automated processing factory to ensure its performance, quality, and durability. Our memory stick uses extra 2oz copper layer and thermal-controlled heatsink to provide better heat dissipation. Supports Intel XMP 2.0 for quick overclocking and compatible with AMD Ryzen x570 chipset.